Encapsulation or potting of electronic boards consists of covering the electronic components with a resin to protect them from shock, vibration, and environmental stresses such as humidity, extreme temperatures, and chemical attack. Epoxy and Polyurethane Resins: Epoxy and polyurethane resins are commonly used for encapsulation. They offer excellent mechanical and electrical resistance, as well as protection against aggressive environments. Encapsulation Process: The process involves pouring the liquid resin onto the electronic board and then allowing it to cure to form a solid protective layer. This can be done manually or mechanically, depending on the specific needs. Advantages: Encapsulation provides additional protection against physical and environmental damage, thus extending the life of the electronic components and ensuring their proper functioning in harsh conditions.






